#11 | WINTER 2008

posted December 3, 2008

Special Supplement

SPECIAL SUPPLEMENT: SOI Industry Consortium*

Into the New Year

SOIconsortium_HoracioMendezBy Horacio Mendez,

Executive Director,

SOI Industry Consortium

 

 

 

The SOI Industry Consortium recently celebrated our one-year anniversary. Congratulations to one and all on our accomplishments to date.

SOI_AnnualEvent2008

 

Our first ever Member Event was held in November in Silicon Valley. About 70 people gathered to learn from each other, plan for the future, share information and celebrate the success of our fi rst year.

The event featured a series of top-notch presentations, lead off by Boon-Khim Liew of Nvidia. His talk, entitled “SOI Technology for GPU?” presented some of the key results from Nvidia’s in-depth analysis of SOI advantages and challenges.

Olivier Faynot of Leti talked about “FDSOI for Low Power”. He detailed important power, performance and variability advantages for fully-depleted (FD) SOI beyond the 22nm node.

Jim Hayden presented data from members of the SOI Consortium Technical Committee in a talk entitled “SOI vs. Bulk Benchmarking Considerations”. The presentation offered methodologies for comparing SOI and bulk process technologies for SoC designs. It addressed questions commonly asked by SoC design teams using standard tool flows, who are starting to investigate SOI.

Subramanian Iyer of the IBM Systems & Technology Group discussed “Embedded memory in SOI: how to prevent your logic from developing amnesia”. He noted that there are substantial savings to be had in moving to an embedded DRAM on SOI, including : SRAM-like performance at DRAM densities; reduced power and Soft Error Rate; full logic compatibility; and a ~3.5X reduction in memory area.

Dr. Wayne Ellis of Innovative Silicon presented “SOI: Revolutionary Memory Solutions”, comparing the advantages of SOI-based fl oating body memory to traditional DRAM.

Many thanks to all those who made this event a success. It was a great way to start our new year.

The Guides

The first chapters of the SOI Implementation Guides are now available, with new chapters being released on an ongoing basis. They are written by Consortium members, covering specific areas of interest, in order to drive common understanding of the value and challenges of SOI.

New chapters include:

  • SOI Circuit Design Overview,
    by Nghia Phan, Distinguished Engineer, IBM Systems and Technology Group
  • SOI overview and assessment for analog and mixed-signal (Part 1),
    by Denis Flandre, Université Catholique de Louvain
  • SOI MOSFET Specifi c Analog Behaviors (Part 2),
    by Denis Flandre, Université Catholique de Louvain
  • Methodologies for Comparing Bulk and SOI Process Technologies for SoC Designs,
    by Jim Hayden and Horacio Mendez, SOI Industry Consortium
  • How do we handle history effects when modeling and designing with SOI?,
    by Faynot, P. Flatresse, O. Thomas, T. Poiroux, CEA-Leti

If your company is a member of the consortium, you can get a copy of these guides under the myConsortium header on the website. This is a password-protected area: if you are eligible but don’t yet have a password, use the “contact us” button.

SOI_MohonkMountain

Recent Events

  • The SOI Consortium exhibited at the GSA Suppliers Expo & Conference, which helped to further raise visibility among all the GSA members who have responded to the SOI survey conducted a few months ago.
  • SOI Consortium members also participated in a panel entitled “Will SOI enter the foundry market?” during the 2008 IEEE International SOI Conference at Mohonk Mountain House in upstate New York.

 

New Members

Now joining the membership roster are:

SOI_logo_Nvidia

Nvidia

 

SOI_logo_ttm

Time To Market

 

Board of Directors 2008-2009

Udo Nothelfer, AMD
Tom Lantzsch, ARM
Laurent Malier, CEA-Leti
Kevin Meyer, Chartered Semiconductor
Dirk Wristers, Freescale Semiconductor
Mark Ireland, IBM
André-Jacques Auberton-Hervé, Soitec
Joel Hartmann, ST Microelectronics
Mike Ma, UMC

 

* Legal Note: The views and opinions expressed by the SOI Industry Consortium through officers in the SOI Industry Consortium or in this presentation or other communication vehicles are not necessarily representative of the views and opinions of individual members. Officers of the SOI Industry Consortium speaking on behalf of the Consortium should not be considered to be speaking for the member company or companies they are associated with, but rather as representing the views of the SOI Industry Consortium. Views and opinions are also subject to change without notice, and the SOI Industry Consortium assumes no obligation to update the information in this communication or accompanying discussions.