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	<title>Advanced Substrate News</title>
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	<link>http://www.advancedsubstratenews.com</link>
	<description>News and stories from our industry and the applications it enables</description>
	<lastBuildDate>Fri, 24 May 2013 08:18:30 +0000</lastBuildDate>
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		<title>MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.</title>
		<link>http://www.advancedsubstratenews.com/2013/05/mosis-a-provider-of-low-cost-prototyping-and-small-volume-production-services-for-custom-ics-has-teamed-up-with-epixfab-the-european-silicon-photonics-support-center-providing-low-cost-prototyping/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/mosis-a-provider-of-low-cost-prototyping-and-small-volume-production-services-for-custom-ics-has-teamed-up-with-epixfab-the-european-silicon-photonics-support-center-providing-low-cost-prototyping/#comments</comments>
		<pubDate>Thu, 23 May 2013 13:28:27 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[ePIXfab]]></category>
		<category><![CDATA[foundry]]></category>
		<category><![CDATA[IMEC]]></category>
		<category><![CDATA[Leti]]></category>
		<category><![CDATA[MOSIS]]></category>
		<category><![CDATA[Photonics]]></category>
		<category><![CDATA[silicon-on-insulator]]></category>
		<category><![CDATA[SOI]]></category>
		<category><![CDATA[Tyndall]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6467</guid>
		<description><![CDATA[MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. The partnership gives MOSIS&#8217; customers access to imec’s state-of-the-art fully integrated silicon photonics processes and Tyndall’s advanced silicon photonics packaging technology. Co-founded by ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2013/05/mosis-a-provider-of-low-cost-prototyping-and-small-volume-production-services-for-custom-ics-has-teamed-up-with-epixfab-the-european-silicon-photonics-support-center-providing-low-cost-prototyping/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Dr. Jean-Pierre Colinge received the 2012 IEEE Andrew S. Grove award at the last ESSDERC-ESSCIRC Conference, for his “contributions to silicon-on-insulator devices and technology.”</title>
		<link>http://www.advancedsubstratenews.com/2013/05/dr-jean-pierre-colinge-received-the-2012-ieee-andrew-s-grove-award-at-the-last-essderc-esscirc-conference-for-his-contributions-to-silicon-on-insulator-devices-and-technology/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/dr-jean-pierre-colinge-received-the-2012-ieee-andrew-s-grove-award-at-the-last-essderc-esscirc-conference-for-his-contributions-to-silicon-on-insulator-devices-and-technology/#comments</comments>
		<pubDate>Thu, 23 May 2013 13:25:41 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[FD-SOI]]></category>
		<category><![CDATA[FinFET]]></category>
		<category><![CDATA[IMEC]]></category>
		<category><![CDATA[R&D]]></category>
		<category><![CDATA[silicon-on-insulator]]></category>
		<category><![CDATA[SOI]]></category>
		<category><![CDATA[TSMC]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6461</guid>
		<description><![CDATA[Dr. Jean-Pierre Colinge received the 2012 IEEE Andrew S. Grove award at the last ESSDERC-ESSCIRC Conference, for his “contributions to silicon-on-insulator devices and technology.” One of the industry&#8217;s most prestigious, the Grove Award is sponsored by the IEEE Electron Devices Society, recognizing “outstanding contributions to solid-state devices and technology.” As noted in the EDS Newsletter, ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2013/05/dr-jean-pierre-colinge-received-the-2012-ieee-andrew-s-grove-award-at-the-last-essderc-esscirc-conference-for-his-contributions-to-silicon-on-insulator-devices-and-technology/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>The FD-SOI design and manufacturing ecosystem has just gotten a €360M boost.</title>
		<link>http://www.advancedsubstratenews.com/2013/05/the-fd-soi-design-and-manufacturing-ecosystem-has-just-gotten-a-e360m-boost/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/the-fd-soi-design-and-manufacturing-ecosystem-has-just-gotten-a-e360m-boost/#comments</comments>
		<pubDate>Thu, 23 May 2013 09:35:24 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6457</guid>
		<description><![CDATA[The FD-SOI design and manufacturing ecosystem has just gotten a €360M boost. A new 3-year public-private project involving 500 engineers from 19 members in seven countries is looking to enable volume manufacturing in Europe from 28nm down to 10nm. The Places2Be project (which stands for Pilot Lines for Advanced CMOS Enhanced by SOI in 2x ...]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>More Good FD-SOI News from DATE Conference – ST, Leti, Mentor, CMP</title>
		<link>http://www.advancedsubstratenews.com/2013/05/more-good-fd-soi-news-from-date-conference-st-leti-mentor-cmp/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/more-good-fd-soi-news-from-date-conference-st-leti-mentor-cmp/#comments</comments>
		<pubDate>Wed, 22 May 2013 10:17:42 +0000</pubDate>
		<dc:creator>Adele HARS</dc:creator>
				<category><![CDATA[Editor's Blog]]></category>
		<category><![CDATA[10nm]]></category>
		<category><![CDATA[28nm]]></category>
		<category><![CDATA[analog]]></category>
		<category><![CDATA[apps]]></category>
		<category><![CDATA[ARM]]></category>
		<category><![CDATA[CMP]]></category>
		<category><![CDATA[conference]]></category>
		<category><![CDATA[design]]></category>
		<category><![CDATA[FD-SOI]]></category>
		<category><![CDATA[FDSOI]]></category>
		<category><![CDATA[foundry]]></category>
		<category><![CDATA[Fully Depleted]]></category>
		<category><![CDATA[GlobalFoundries]]></category>
		<category><![CDATA[high-performance]]></category>
		<category><![CDATA[Leti]]></category>
		<category><![CDATA[low-power]]></category>
		<category><![CDATA[manufacturing]]></category>
		<category><![CDATA[Mentor]]></category>
		<category><![CDATA[mobile]]></category>
		<category><![CDATA[silicon-on-insulator]]></category>
		<category><![CDATA[SOC]]></category>
		<category><![CDATA[ST]]></category>
		<category><![CDATA[STMicroelectronics]]></category>
		<category><![CDATA[UTBB]]></category>
		<category><![CDATA[wafers]]></category>
		<category><![CDATA[wireless]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6433</guid>
		<description><![CDATA[At the recent DATE Conference in Grenoble (DATE is like DAC, but in Europe, alternating yearly between Grenoble and Dresden), STMicroelectronics, CEA-Leti &#38; Mentor Graphics joined forces for a FD-SOI presentation organized by CMP and sponsored by Mentor. Here are some of the highlights (the complete presentations are all available from the CMP website). FD-SOI: ...]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>IEEE SOI Conference (Oct., Monterey) Expands, Extends Call for Papers</title>
		<link>http://www.advancedsubstratenews.com/2013/05/ieee-soi-conference-oct-monterey-expands-extends-call-for-papers/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/ieee-soi-conference-oct-monterey-expands-extends-call-for-papers/#comments</comments>
		<pubDate>Fri, 17 May 2013 08:30:47 +0000</pubDate>
		<dc:creator>Jean-Luc PELLOIE</dc:creator>
				<category><![CDATA[Advanced Substrate Corners]]></category>
		<category><![CDATA[Conferences]]></category>
		<category><![CDATA[3D]]></category>
		<category><![CDATA[ARM]]></category>
		<category><![CDATA[conference]]></category>
		<category><![CDATA[silicon-on-insulator]]></category>
		<category><![CDATA[SOI]]></category>
		<category><![CDATA[ultra-low-power]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6406</guid>
		<description><![CDATA[IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference Hyatt Regency Monterey Hotel and Spa, Monterey, California October 7th thru 10th, 2013 In 2013, an exciting new event named IEEE S3S will take place in Monterey, CA. This industry-wide event is founded upon the co-location of two IEEE conferences that have been at the leading edge of CMOS ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2013/05/ieee-soi-conference-oct-monterey-expands-extends-call-for-papers/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>SiTime has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP)</title>
		<link>http://www.advancedsubstratenews.com/2013/05/sitime-has-entered-the-smartphonetabletmobile-app-market-with-the-first-mems-oscillator-in-a-chip-scale-package-csp/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/sitime-has-entered-the-smartphonetabletmobile-app-market-with-the-first-mems-oscillator-in-a-chip-scale-package-csp/#comments</comments>
		<pubDate>Fri, 10 May 2013 15:18:42 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[analog]]></category>
		<category><![CDATA[apps]]></category>
		<category><![CDATA[design]]></category>
		<category><![CDATA[embedded]]></category>
		<category><![CDATA[low-power]]></category>
		<category><![CDATA[MEMS]]></category>
		<category><![CDATA[mobile]]></category>
		<category><![CDATA[SiTime]]></category>
		<category><![CDATA[smartphone]]></category>
		<category><![CDATA[SOI-MEMS]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6339</guid>
		<description><![CDATA[SiTime, which leverages SOI for high-performance MEMS timing solutions, has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP). SiTime’s solutions offer area savings of 85%, cut power by 50% and are 15 times more reliable, all of which enable smaller, lower power and longer lasting mobile electronics. ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2013/05/sitime-has-entered-the-smartphonetabletmobile-app-market-with-the-first-mems-oscillator-in-a-chip-scale-package-csp/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>An agreement between Soitec and GT Advanced Technologies is aiming to lower the cost of LED production and accelerate adoption in commercial and residential lighting</title>
		<link>http://www.advancedsubstratenews.com/2013/05/an-agreement-between-soitec-and-gt-advanced-technologies-is-aiming-to-lower-the-cost-of-led-production-and-accelerate-adoption-in-commercial-and-residential-lighting/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/an-agreement-between-soitec-and-gt-advanced-technologies-is-aiming-to-lower-the-cost-of-led-production-and-accelerate-adoption-in-commercial-and-residential-lighting/#comments</comments>
		<pubDate>Mon, 06 May 2013 15:03:46 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[GaN]]></category>
		<category><![CDATA[GT]]></category>
		<category><![CDATA[HVPE]]></category>
		<category><![CDATA[led]]></category>
		<category><![CDATA[lighting]]></category>
		<category><![CDATA[sapphire]]></category>
		<category><![CDATA[Soitec]]></category>
		<category><![CDATA[wafers]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6329</guid>
		<description><![CDATA[An agreement between Soitec and GT Advanced Technologies is aiming to lower the cost of LED production and accelerate adoption in commercial and residential lighting. GT is developing an HVPE (high productivity hydride vapor phase epitaxy) system incorporating Soitec Phoenix Labs’ (a subsidiary of Soitec) unique and proprietary HVPE technology. This includes Soitec&#8217;s novel and ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2013/05/an-agreement-between-soitec-and-gt-advanced-technologies-is-aiming-to-lower-the-cost-of-led-production-and-accelerate-adoption-in-commercial-and-residential-lighting/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Soitec&#8217;s Smart Cut™ technology is now being leveraged to produce GaN substrates for high-performance LED lighting applications</title>
		<link>http://www.advancedsubstratenews.com/2013/05/soitecs-smart-cut-technology-is-now-being-leveraged-to-produce-gan-substrates-for-high-performance-led-lighting-applications/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/soitecs-smart-cut-technology-is-now-being-leveraged-to-produce-gan-substrates-for-high-performance-led-lighting-applications/#comments</comments>
		<pubDate>Mon, 06 May 2013 14:58:51 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[GaN]]></category>
		<category><![CDATA[led]]></category>
		<category><![CDATA[lighting]]></category>
		<category><![CDATA[SmartCut]]></category>
		<category><![CDATA[Soitec]]></category>
		<category><![CDATA[Sumitomo]]></category>
		<category><![CDATA[wafers]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6322</guid>
		<description><![CDATA[Soitec&#8216;s Smart Cut™ technology, best known for its role as the leading technology for producing SOI wafers, is now being leveraged to produce GaN substrates for high-performance LED lighting applications. Following a successful pilot line announced last year, Sumitomo Electric will now industrialize the product and invest in Smart Cut technology. Yoshiki Miura, general manager ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2013/05/soitecs-smart-cut-technology-is-now-being-leveraged-to-produce-gan-substrates-for-high-performance-led-lighting-applications/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>ST&#8217;s FD-SOI Wins EETimes ACE Award&#8230; and Customers!</title>
		<link>http://www.advancedsubstratenews.com/2013/05/sts-fd-soi-wins-eetimes-ace-award-and-customers/</link>
		<comments>http://www.advancedsubstratenews.com/2013/05/sts-fd-soi-wins-eetimes-ace-award-and-customers/#comments</comments>
		<pubDate>Thu, 02 May 2013 11:57:24 +0000</pubDate>
		<dc:creator>Adele HARS</dc:creator>
				<category><![CDATA[Editor's Blog]]></category>
		<category><![CDATA[apps]]></category>
		<category><![CDATA[design]]></category>
		<category><![CDATA[FD-SOI]]></category>
		<category><![CDATA[FDSOI]]></category>
		<category><![CDATA[Fully Depleted]]></category>
		<category><![CDATA[manufacturing]]></category>
		<category><![CDATA[mobile]]></category>
		<category><![CDATA[performance]]></category>
		<category><![CDATA[power]]></category>
		<category><![CDATA[silicon-on-insulator]]></category>
		<category><![CDATA[SOC]]></category>
		<category><![CDATA[ST]]></category>
		<category><![CDATA[STMicroelectronics]]></category>
		<category><![CDATA[UTBB]]></category>
		<category><![CDATA[wireless]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6307</guid>
		<description><![CDATA[Two important FD-SOI wins for STMicroelectronics have just been announced: The EETimes ACE Award for Energy Technology; Customers. The Energy Technology Award was presented at a ceremony for the 2013 Annual Creativity in Electronics (ACE) Awards. It is given by EETimes and EDN, two of the most prominent trade-media sources in electronics. The ACE Awards ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2013/05/sts-fd-soi-wins-eetimes-ace-award-and-customers/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>FD-SOI Forum 2013 in Hsinchu, Taiwan &#8211; Presentations available online!</title>
		<link>http://www.advancedsubstratenews.com/2013/04/fd-soi-forum-2013-in-hsinchu-taiwan-presentations-available-online/</link>
		<comments>http://www.advancedsubstratenews.com/2013/04/fd-soi-forum-2013-in-hsinchu-taiwan-presentations-available-online/#comments</comments>
		<pubDate>Fri, 26 Apr 2013 11:48:28 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=6298</guid>
		<description><![CDATA[On April 22, 2013, leading companies from the SOI Industry Consortium organized a forum focused on fully depleted technologies for highly energy-efficient System-on-Chip applications. This forum was co-organized by Horacio Mendez from the SOI Consortium, Gary Patton from IBM and Mike Noonen from GLOBALFOUNDRIES. The presentations are now posted on the SOI Industry Consortium website: ...]]></description>
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