<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>Advanced Substrate News</title>
	<atom:link href="http://www.advancedsubstratenews.com/feed/" rel="self" type="application/rss+xml" />
	<link>http://www.advancedsubstratenews.com</link>
	<description>News and stories from our industry and the applications it enables</description>
	<lastBuildDate>Thu, 16 Feb 2012 17:45:08 +0000</lastBuildDate>
	<language>en</language>
	<sy:updatePeriod>hourly</sy:updatePeriod>
	<sy:updateFrequency>1</sy:updateFrequency>
	<generator>http://wordpress.org/?v=3.3.1</generator>
	<atom:link rel='hub' href='http://www.advancedsubstratenews.com/?pushpress=hub'/>
		<item>
		<title>FD-SOI – A Look at Recent Consortium ResultsPart 1 of 3: Manufacturing</title>
		<link>http://www.advancedsubstratenews.com/2012/02/fd-soi-a-look-at-recent-consortium-resultspart-1-of-3-manufacturing/</link>
		<comments>http://www.advancedsubstratenews.com/2012/02/fd-soi-a-look-at-recent-consortium-resultspart-1-of-3-manufacturing/#comments</comments>
		<pubDate>Thu, 16 Feb 2012 17:39:49 +0000</pubDate>
		<dc:creator>Adele HARS</dc:creator>
				<category><![CDATA[Editor's Blog]]></category>
		<category><![CDATA[20nm]]></category>
		<category><![CDATA[28nm]]></category>
		<category><![CDATA[ARM]]></category>
		<category><![CDATA[design]]></category>
		<category><![CDATA[FinFET]]></category>
		<category><![CDATA[foundry]]></category>
		<category><![CDATA[GlobalFoundries]]></category>
		<category><![CDATA[IBM]]></category>
		<category><![CDATA[power]]></category>
		<category><![CDATA[SOI Consortium FD-SOI]]></category>
		<category><![CDATA[SPICE]]></category>
		<category><![CDATA[STMicroelectronics]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5395</guid>
		<description><![CDATA[The results of the most recent SOI Consortium benchmarking study detail the interest of planar FD-SOI as early as the 28nm and 20nm technology nodes, in terms of performance, power and manufacturability. This 3-part blog series looks further at some of the implications. Chipmakers constantly have to manage risk.  Generally it is sensible not to ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/02/fd-soi-a-look-at-recent-consortium-resultspart-1-of-3-manufacturing/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>FD-SOI Workshop in SF Follows ISSCC &#8211; Registration (Free!) Now Open</title>
		<link>http://www.advancedsubstratenews.com/2012/02/fd-soi-workshop-in-sf-follows-isscc-registration-free-now-open/</link>
		<comments>http://www.advancedsubstratenews.com/2012/02/fd-soi-workshop-in-sf-follows-isscc-registration-free-now-open/#comments</comments>
		<pubDate>Tue, 07 Feb 2012 12:32:15 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Advanced Substrate Corners]]></category>
		<category><![CDATA[Conferences]]></category>
		<category><![CDATA[20/22nm]]></category>
		<category><![CDATA[28nm]]></category>
		<category><![CDATA[Accelicon]]></category>
		<category><![CDATA[ARM]]></category>
		<category><![CDATA[design]]></category>
		<category><![CDATA[FD-SOI]]></category>
		<category><![CDATA[FinFET]]></category>
		<category><![CDATA[foundry]]></category>
		<category><![CDATA[IBM]]></category>
		<category><![CDATA[Leti]]></category>
		<category><![CDATA[low-power]]></category>
		<category><![CDATA[modeling]]></category>
		<category><![CDATA[SOC]]></category>
		<category><![CDATA[SOI Consortium]]></category>
		<category><![CDATA[Soitec]]></category>
		<category><![CDATA[ST]]></category>
		<category><![CDATA[UCBerkeley]]></category>
		<category><![CDATA[wafers]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5369</guid>
		<description><![CDATA[Want to learn first-hand what&#8217;s going on in the world of FD-SOI? (aka Fully-Depleted Silicon-On-Insulator) The SOI Industry Consortium, CEA-Leti and Soitec are organizing the 6th edition of the Fully Depleted Workshop. Presentations will be given by experts from ST, ARM, IBM, Leti, UCBerkeley, Soitec, Accelicon &#38; the SOI Consortium. It&#8217;s a full-day event at ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/02/fd-soi-workshop-in-sf-follows-isscc-registration-free-now-open/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>IEDM 11: The SOI Papers</title>
		<link>http://www.advancedsubstratenews.com/2012/02/iedm-11-the-soi-papers/</link>
		<comments>http://www.advancedsubstratenews.com/2012/02/iedm-11-the-soi-papers/#comments</comments>
		<pubDate>Tue, 07 Feb 2012 11:34:00 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Paperlinks]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5356</guid>
		<description><![CDATA[Held every December, the IEEE International Electron Devices Meeting (IEDM) (www.ieee-iedm.org) presents the best applied research in electronics from corporate, university and government labs around the world. Brief descriptions of the IEDM 2011 papers with research related to SOI and some other advanced substrates follows. The full program is available at: http://www.his.com/~iedm/program/11advprg.pdf The papers themselves ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/02/iedm-11-the-soi-papers/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display</title>
		<link>http://www.advancedsubstratenews.com/2012/02/stmicroelectronics-predicts-its-new-soi-based-stod13as-power-chip-could-be-used-in-nearly-every-new-smartphone-or-small-electronic-device-that-has-an-amoled-display/</link>
		<comments>http://www.advancedsubstratenews.com/2012/02/stmicroelectronics-predicts-its-new-soi-based-stod13as-power-chip-could-be-used-in-nearly-every-new-smartphone-or-small-electronic-device-that-has-an-amoled-display/#comments</comments>
		<pubDate>Fri, 03 Feb 2012 16:07:05 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[apps]]></category>
		<category><![CDATA[display]]></category>
		<category><![CDATA[embedded]]></category>
		<category><![CDATA[power]]></category>
		<category><![CDATA[ST]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5336</guid>
		<description><![CDATA[STMicroelectronics predicts its new SOI-based STOD13AS power chip could be used in nearly every new smartphone or small electronic device that has an AMOLED display. ST, which already supplies over 80% of the market for these ultra-thin, vivid displays, says SOI ensures outstanding energy efficiency for longer battery life, and high immunity to noise for ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/02/stmicroelectronics-predicts-its-new-soi-based-stod13as-power-chip-could-be-used-in-nearly-every-new-smartphone-or-small-electronic-device-that-has-an-amoled-display/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte&#8217;s diagnostic and molecular detection equipment</title>
		<link>http://www.advancedsubstratenews.com/2012/01/imec-and-genalyte-have-successfully-developed-and-produced-a-set-of-disposable-soi-photonics-biosensor-chips-for-genalytes-diagnostic-and-molecular-detection-equipment/</link>
		<comments>http://www.advancedsubstratenews.com/2012/01/imec-and-genalyte-have-successfully-developed-and-produced-a-set-of-disposable-soi-photonics-biosensor-chips-for-genalytes-diagnostic-and-molecular-detection-equipment/#comments</comments>
		<pubDate>Tue, 31 Jan 2012 13:59:56 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[apps]]></category>
		<category><![CDATA[embedded]]></category>
		<category><![CDATA[IMEC]]></category>
		<category><![CDATA[medical]]></category>
		<category><![CDATA[Photonics]]></category>
		<category><![CDATA[sensors]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5328</guid>
		<description><![CDATA[Imec and Genalyte have successfully developed and produced a set of disposable SOI-photonics biosensor chips for Genalyte&#8216;s diagnostic and molecular detection equipment. Founded by SOI-photonics innovator Dr. Cary Gunn, Genalyte chips contain ring resonator sensors for very sensitive molecular detection; on-chip grating couples infrared light to diagnostic equipment.]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/01/imec-and-genalyte-have-successfully-developed-and-produced-a-set-of-disposable-soi-photonics-biosensor-chips-for-genalytes-diagnostic-and-molecular-detection-equipment/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>The international Sematech consortium announced that SOI wafer leader Soitec has joined the Front End Processes (FEP) and Advanced Metrology Programs</title>
		<link>http://www.advancedsubstratenews.com/2012/01/the-internationalsematech-consortium-announced-that-soi-wafer-leader-soitec-has-joined-the-front-end-processes-fep-and-advanced-metrology-programs/</link>
		<comments>http://www.advancedsubstratenews.com/2012/01/the-internationalsematech-consortium-announced-that-soi-wafer-leader-soitec-has-joined-the-front-end-processes-fep-and-advanced-metrology-programs/#comments</comments>
		<pubDate>Fri, 27 Jan 2012 12:50:18 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[FD-SOI]]></category>
		<category><![CDATA[FinFET]]></category>
		<category><![CDATA[metrology]]></category>
		<category><![CDATA[R&D]]></category>
		<category><![CDATA[Sematech]]></category>
		<category><![CDATA[Soitec]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5318</guid>
		<description><![CDATA[The international Sematech consortium announced that SOI wafer leader Soitec has joined the Front End Processes (FEP) and Advanced Metrology Programs. Soitec will collaborate with SEMATECH’s material and metrology experts and leverage Sematech&#8217;s activities in advanced metrology, materials, process technology, and device characterization to extend CMOS and high-mobility FinFET technologies for high-performance, low-power IC applications.]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/01/the-internationalsematech-consortium-announced-that-soi-wafer-leader-soitec-has-joined-the-front-end-processes-fep-and-advanced-metrology-programs/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Skyworks credits part of its Q1 FY12 success to having commenced volume production of advanced SOI-based Antenna Switch Modules (ASMs) for Huawei</title>
		<link>http://www.advancedsubstratenews.com/2012/01/skyworks-credits-part-of-its-q1-fy12-success-to-having-commenced-volume-production-of-advanced-soi-based-antenna-switch-modules-asms-for-huawei/</link>
		<comments>http://www.advancedsubstratenews.com/2012/01/skyworks-credits-part-of-its-q1-fy12-success-to-having-commenced-volume-production-of-advanced-soi-based-antenna-switch-modules-asms-for-huawei/#comments</comments>
		<pubDate>Fri, 27 Jan 2012 12:47:24 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[apps]]></category>
		<category><![CDATA[China]]></category>
		<category><![CDATA[embedded]]></category>
		<category><![CDATA[Skyworks]]></category>
		<category><![CDATA[telecom]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5314</guid>
		<description><![CDATA[Skyworks credits part of its Q1 FY12 success to having commenced volume production of advanced SOI-based Antenna Switch Modules (ASMs) for Huawei. With ongoing development of advanced switching solutions for handsets, data cards, and other applications, Skyworks cites the SKY18108 as one example of their recent ASMs tailored to meet the needs and requirements of ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/01/skyworks-credits-part-of-its-q1-fy12-success-to-having-commenced-volume-production-of-advanced-soi-based-antenna-switch-modules-asms-for-huawei/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Soitec and Sumitomo Electric are launching pilot production of 4” and 6” GaN wafers for the LED and power markets</title>
		<link>http://www.advancedsubstratenews.com/2012/01/soitec-and-sumitomo-electric-are-launching-pilot-production-of-4-and-6-gan-wafers-for-the-led-and-power-markets/</link>
		<comments>http://www.advancedsubstratenews.com/2012/01/soitec-and-sumitomo-electric-are-launching-pilot-production-of-4-and-6-gan-wafers-for-the-led-and-power-markets/#comments</comments>
		<pubDate>Thu, 26 Jan 2012 11:11:59 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[GaN]]></category>
		<category><![CDATA[led]]></category>
		<category><![CDATA[lighting]]></category>
		<category><![CDATA[power]]></category>
		<category><![CDATA[Smart Cut]]></category>
		<category><![CDATA[Soitec]]></category>
		<category><![CDATA[Sumitomo]]></category>
		<category><![CDATA[wafers]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5303</guid>
		<description><![CDATA[World-leading advanced substrate maker Soitec and compound materials leader Sumitomo Electric are launching pilot production of 4” and 6” GaN wafers for the LED and power markets. Soitec applies its Smart CutTM layer-transfer process to Sumitomo&#8217;s bulk GaN wafers to generate engineered wafers with the same thermal expansion (CTE) as standard GaN wafers but at ...]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/01/soitec-and-sumitomo-electric-are-launching-pilot-production-of-4-and-6-gan-wafers-for-the-led-and-power-markets/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>Grace Semiconductor has added 0.13um SOI RF CMOS to its Technology Roadmap for Q2 2011</title>
		<link>http://www.advancedsubstratenews.com/2012/01/grace-semiconductor-has-added-0-13um-soi-rf-cmos-to-its-technology-roadmap-for-q2-2011/</link>
		<comments>http://www.advancedsubstratenews.com/2012/01/grace-semiconductor-has-added-0-13um-soi-rf-cmos-to-its-technology-roadmap-for-q2-2011/#comments</comments>
		<pubDate>Thu, 26 Jan 2012 11:09:45 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[China]]></category>
		<category><![CDATA[design]]></category>
		<category><![CDATA[foundry]]></category>
		<category><![CDATA[Grace]]></category>
		<category><![CDATA[rf]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5300</guid>
		<description><![CDATA[Grace Semiconductor, a leading foundry in China, added 0.13um SOI RF CMOS to its Technology Roadmap in Q2 2011. (Courtesy: Grace Semiconductor)]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/01/grace-semiconductor-has-added-0-13um-soi-rf-cmos-to-its-technology-roadmap-for-q2-2011/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>NXP unveiled its ultra-compact, high-precision SOI-MEMS-based frequency synthesizer</title>
		<link>http://www.advancedsubstratenews.com/2012/01/nxp-unveiled-its-ultra-compact-high-precision-soi-mems-based-frequency-synthesizer/</link>
		<comments>http://www.advancedsubstratenews.com/2012/01/nxp-unveiled-its-ultra-compact-high-precision-soi-mems-based-frequency-synthesizer/#comments</comments>
		<pubDate>Thu, 26 Jan 2012 11:06:57 +0000</pubDate>
		<dc:creator>Advanced Substrate News</dc:creator>
				<category><![CDATA[Industry Buzz]]></category>
		<category><![CDATA[apps]]></category>
		<category><![CDATA[embedded]]></category>
		<category><![CDATA[MEMS]]></category>
		<category><![CDATA[NXP]]></category>
		<category><![CDATA[telecom]]></category>

		<guid isPermaLink="false">http://www.advancedsubstratenews.com/?p=5296</guid>
		<description><![CDATA[At CES 2012, NXP unveiled its ultra-compact, high-precision SOI-MEMS-based frequency synthesizer as an alternative to quartz crystal-based timing devices. These timing devices target communications equipment using Gigabit Ethernet, USB, PCI-Express and S-ATA, plus CPU timing, memory and control in consumer electronics devices.]]></description>
		<wfw:commentRss>http://www.advancedsubstratenews.com/2012/01/nxp-unveiled-its-ultra-compact-high-precision-soi-mems-based-frequency-synthesizer/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
	</channel>
</rss>

