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Articles by Thomas GLINSNER

Thomas GLINSNER

Thomas GLINSNER has written 1 articles on Advanced Substrate News.

Thomas Glinsner is head of product management for EV Group, based at the company’s headquarters in Austria. He oversees product development for lithography, wafer bonding, nanoimprinting and hot embossing. Glinsner holds a degree in technical chemistry from the Technical University in Vienna, and a Ph.D. from the University of Linz, Solid State and Semiconductor Physics Department.

EVG Takes on 450 mm and SOI with Newest Wafer-Bonding System Thumbnail

EVG Takes on 450 mm and SOI with Newest Wafer-Bonding System

Posted by Thomas GLINSNER (EV Group) on October 28, 2011
In ASN #18, Design & Manufacturing, In & Around Our Industry
Tagged with , ,

EVG’s new wafer bonding system is a fully automated tool for production-level fabrication of 450mm SOI wafers. Transitioning to larger wafers heightens the need for process uniformity.  Wafer bonding is no exception, as process parameters must be applied with a high degree of both precision and uniformity.  This requirement will become particularly critical within the …

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