Smaller Pixels, Brighter Pictures
Posted by François ROY (STMicroelectronics) on July 16, 2008In Advanced Substrate Corners, ASN #10, Imaging
Tagged with apps, BSI, embedded, sensors, SOI, ST
ST’s 3-megapixel back-illuminated image sensor for digital cameras leverages SOI, direct wafer-level bonding and thinning technologies, improving 1.45 x 1.45 µm² pixel quantum efficiency over 60%. To meet consumer demand for higher-quality digital cameras embedded in a widening array of mobile devices, designers need image sensors with very small pixels (higher resolution, smaller, cheaper and …
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