SOI Substrates Meet Needs of Advanced Devices
Posted by Bich-Yen NGUYEN (Soitec) on May 14, 2008In Advanced Substrate Corners, ASN #9, R&D/Labnews
Tagged with FD-SOI, SOI, Soitec
The ITRS calls for ultra-thin body devices to enter manufacturing in just a few years. The stringent SOI substrate requirements are met with high-volume manufacturing technology. SOI technology is developing toward Ultra-Thin Body (UTB) semiconductor layers with fully depleted (FD-SOI) and Multiple Gate FETs (MuGFETs), consistent with the latest version of the ITRS. The current …
Continue ReadingLeave a Comment









