SOI on the Roadmaps
• FD-SOI: ST & 28nm SOCs; ARM & design porting
• Apps – NXP automotive sensors, AMD 32nm Bulldozer
• SOI Conference (IBM, Intel, Leti, GloFo, ST, ARM, Peregrine & more)
• SOI Consortium – FD-SOI whitepaper overview & excerpts
FD-SOI: The Right Choice & more
• Planar FD-SOI - wafers, Consortium update
• Apps – Xbox 360 CPU/GPU, ST/power
• GlobalFoundries on ESD
• Wafer stacking, MEMS, photonics & more
SOI & The Lighting Revolution; Wafers for FD-SOI
• Soitec's wafers for FD-SOI
• Special supplement: SOI Industry Consortium
• Lighting apps: NXP+SOI=better CFLs
• ARM & SPICE, Industry Buzz and more
Adele HARS has written 26 articles on Advanced Substrate News.
Editor-in-Chief at Advanced Substrate News - Director at High Tech International Adele Hars has been the Editor-in-Chief of Advanced Substrate News since its creation in 2005. She has been writing in and around the electronics industry for over 25 years. As a contributing editor, she first wrote about SOI for Semiconductor International in the mid-1990's. Over the years, her work appeared in EETimes, Design News, Lightwave, Control Engineering, Byte, Computer Graphics World, Automotive Industries, Multichannel News and more. She holds a B.A. from Vassar College.
The AMD PR folks are calling their new Fusion APUs the era of “Personal Supercomputing” – and its flagships are on 32nm SOI We’ve been hearing about these revolutionary chips for years now – the “Fusion” of graphics chips – GPUs – and CPUs on a single piece of silicon, which they’re referring to as …
Continue ReadingLeave a CommentWhat will 2011 bring in the world of SOI? The hot topic will no doubt be FD-SOI – the planar, fully-depleted SOI solution that’s the top contender for mobile, low power and SoC apps at the 22nm node. You’ll be learning about how it will maximize performance, manufacturability and reduce overall cost. The pieces are …
Continue ReadingView Comments (2)“SOI SPICE models that predict actual results with the greatest accuracy enable designers to fully exploit design trade-offs in terms of power, performance and area (PPA),” says ARM SOI guru Jean Luc Pelloie. With that in mind, the ARM team presented a quiet paper at the last IEEE SOI Conference (Oct. 2010) – but one …
Continue ReadingLeave a CommentFor five wonderful years, we’ve had a terrific paper and electronic version of Advanced Substrate News – aka ASN – bringing you must-read pieces from in and around the SOI and engineered substrates ecosystem. That’s not going to change. We’ve had hundreds of articles contributed by experts from all walks of industry and academia. That’s …
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SOI is poised to take center stage in the impending lighting revolution, with companies like NXP leading the charge. Here’s why. Incandescent bulbs are being phased out or banned worldwide: European bans started taking effect in 2009; the US, Canada, Japan and Russia will start in 2012. India, Brazil, China and many more have all …
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FD-SOI is making the move towards industrialization. In this issue of ASN, experts from IBM, ST, Hitachi, Leti and Soitec detail their approaches. What is it ? In planar FD-SOI (as opposed to the verticality of FinFETs), CMOS transistors are built into an ultra-thin layer of silicon over a Buried Oxide (BOx) (which can optionally …
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It’s on SOI. Here’s Why. Toshiba’s new Cell Regza TV is poised to redefine both high-definition (HD) TV and TV-Internet convergence. At the heart of this strategy is the SOI-based Cell processor. It was almost a decade ago when Toshiba first teamed with IBM and Sony to create the Cell. The SOI-based solution enabled the …
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