The multi-core CPU in Nintendo’s new Wii U is fabbed by IBM on 45nm SOI

• American Semiconductor has announced the FleX-MCU™ product family. - American Semiconductor has announced the FleX-MCU™ product family. Leveraging an SOI starting wafer, the FleX-MCU is the world's first physically flexible... More →
• Soitec has announced the industry's first four-junction solar cell for concentrator photovoltaic (CPV) systems, entering the industry's roadmap at a world-class level with 43.6 % efficiency. - Soitechasannounced the industry's first four-junction solar cellfor concentrator photovoltaic (CPV) systems, entering the industry's roadmap at a world-class... More →
• SOI and other advanced substrate based technologies will be significant beneficiaries of the European Commission's “New European Industrial Strategy for Electronics”, targeting the mobilization of €100 billion in new private investments. - SOI and other advanced substrate based technologies will be significant beneficiaries of the European Commission's “New European Industrial Strategy for... More →
• In the three months following Peregrine Semi's announcement of the latest version of its UltraCMOS® process technology, the company has followed with a steady stream of news - In the three months following Peregrine Semi's announcement of the latest version of its UltraCMOS® process technology, STeP8 for RF Front End ICs, the... More →
• Targeting low-power SRAM for FD-SOI and FinFETs, UK physical IP start-up sureCore has received a £250K grant from the Technology Strategy Board SMART - Targeting low-power SRAM for FD-SOI and FinFETs, UK physical IP start-up sureCore has received a £250K grant (about 292K Euros or $380.5K) from the Technology... More →
• MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. - MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with ePIXfab, the European Silicon Photonics... More →
• Dr. Jean-Pierre Colinge received the 2012 IEEE Andrew S. Grove award at the last ESSDERC-ESSCIRC Conference, for his “contributions to silicon-on-insulator devices and technology.” - IEEE Division I Director, Cor Claeys (right) of imec, honoring Dr. Jean-Pierre Colinge (left) of TSMC for receiving - the 2012 Andrew S. Grove Award for his... More →
• The FD-SOI design and manufacturing ecosystem has just gotten a €360M boost. - The FD-SOI design and manufacturing ecosystem has just gotten a €360M boost. A new 3-year public-private project involving 500 engineers from 19 members in... More →
• SiTime has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a chip scale package (CSP) - SiTime, which leverages SOI for high-performance MEMS timing solutions, has entered the smartphone/tablet/mobile app market with the first MEMS oscillator in a... More →
• An agreement between Soitec and GT Advanced Technologies is aiming to lower the cost of LED production and accelerate adoption in commercial and residential lighting - An agreement between Soitec and GT Advanced Technologies is aiming to lower the cost of LED production and accelerate adoption in commercial and residential... More →
• Soitec's Smart Cut™ technology is now being leveraged to produce GaN substrates for high-performance LED lighting applications - Soitec's Smart Cut™ technology, best known for its role as the leading technology for producing SOI wafers, is now being leveraged to produce GaN substrates... More →
• FD-SOI Forum 2013 in Hsinchu, Taiwan - Presentations available online! - On April 22, 2013, leading companies from the SOI Industry Consortium organized a forum focused on fully depleted technologies for highly energy-efficient... More →
• DARPA reports that a team of researchers at the University of Southern California and Columbia University has achieved output power levels of nearly 0.5W at 45 GHz with a 45nm SOI CMOS chip - (Image courtesy of DARPA and Columbia University) - DARPA reports that a team of researchers at the University of Southern California and Columbia University... More →
• Altis Semiconductor will be a foundry partner for the IBM 180nm SOI technology - Specialty foundry Altis Semiconductor will be a foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and... More →
• Peregrine has announced the latest version of UltraCMOS® process technology-Semiconductor Technology Platform 8 (STeP8) - Peregrine has announced the latest version of UltraCMOS® process technology—Semiconductor Technology Platform 8 (STeP8), which the company says enables... More →

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Fully-Depleted SOI (and more) at VLSI (Kyoto): some knock-your-socks-off papers

IEDM 11: The SOI Papers

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14nm 20nm 28nm 45nm AMD analog apps ARM automotive conference design embedded FD-SOI FinFET foundry Freescale GaN GlobalFoundries high-perf high-temp high-voltage IBM Intel Leti lighting low-power markets medical memory MEMS mil/aero mobile NXP Photonics power R&D rf sensors silicon-on-insulator SOC SOI SOI Consortium Soitec ST wafers

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