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Industry Buzz

INDUSTRY BUZZ

  • May 27, 2016 - “We intend to focus all new engagements in design using 28nm FD-SOI,” Samsung Semi’s Kelvin Low told SemiEngineering’s Mark Lapedus in a recent article (read it here). - Low, who’s senior directory of the company’s foundry marketing says they’ll of course continue to support existing 28nm bulk customers, “But we think FD-SOI has enough benefits to attract new customers... Read more »
  • May 11, 2016 - FD-SOI will be featured in the upcoming Symposia on VLSI Technology & Circuits (Honolulu, Hawaii from June 13-17, 2016 – click here for more info). The theme of the conference is “Inflections for a Smart Society,” and luminaries from throughout the SOI ecosystem will be featured in presentations, short courses and panel discussions. - A short course entitle “Circuit Design... Read more »
  • April 29, 2016 - From RF-SOI pioneer Peregrine Semi comes a steady stream of new chips and design wins. - News include: - Two UltraCMOS® MPAC–Doherty products—the PE46130 and PE46140 (press release here). These monolithic phase and amplitude controllers (MPAC) join the PE46120 in offering maximum phase-tuning flexibility for Doherty power amplifier (PA) optimization. Designed for the LTE and LTE-A... Read more »
  • April 25, 2016 - Registration is open for GlobalFoundries' technical webinar, “How to Implement an ARM Cortex-A17 Processor in 22FDX 22nm FD-SOI Technology” (click here to go to the registration page). The webinar will cover the optimal steps to successfully implement ARM® Cortex®-A Series* processors using 22FDXTM 22nm FD-SOI technology. - GF Design Enablement Fellow Dr. Joerg Winkler will... Read more »
  • April 7, 2016 - GlobalFoundries recently announced availability of a new set of RF-SOI PDKs for the company's 7SW SOI technology. GF, which has now delivered more than 20 billion RF-SOI chips for the world’s smartphones, tablets and more, notes that its 7SW SOI technology is optimized for multi-band RF switching in next-generation smartphones. It is also poised to drive innovation in IoT... Read more »
  • April 5, 2016 - Three of the world's More-than-Moore and SOI technology development powerhouses have signed a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies for the emerging IoT market. SITRI of Shanghai, and CEA-Leti and Minatec of Grenoble will work together to accelerate the adoption of their latest technologies and create a global innovation... Read more »
  • March 31, 2016 - Coupling Wave Solutions (CWS) has a new productivity tool called SiPEX, which enables RF-SOI designers to increase the number of design iterations—including Spice simulation—up to 10 times in the same time frame. - “With SiPEX, RF switch designers will be able to make their design changes in less than 15 minutes and obtain a few decibels (dB) of variation over silicon measurements... Read more »
  • March 23, 2016 - Don't forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For Papers (CFP) deadline is April 15, 2016. As we noted for you in ASN back in December, the theme of the conference, which will take place October 10th – 13th in San Francisco, is “Energy Efficient Technology for the Internet of Things”. -... Read more »
  • March 18, 2016 - EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC) will feature a keynote talk by GlobalFoundries' Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing. The talk, entitled, "RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow",will kick off the newly added RF-SOI Technology Track.... Read more »
  • February 12, 2016 - Peregrine Semiconductor’s new 75-ohm glitch-less RF digital step attenuator, the UltraCMOS® PE4314, is ideal for wired broadband applications. - RF-SOI pioneer Peregrine Semiconductor has announced theUltraCMOS® PE4314, a 75-ohm glitch-less RF digital step attenuator (DSA). This new DSA extends Peregrine’s existing glitch-less DSA portfolio to 75 ohms. The PE4314 is ideal for... Read more »
  • February 8, 2016 - Professor Jean-Pierre Raskin (right) receiving the Blondel Medal for his industry-changing work on RF-SOI. Jury president Professor Pere Rocal I Cabarrocas (left) of the Ecole Polytechnique - Université Paris-Saclay presented the prize. - RF-SOI substrate guru Jean-Pierre Raskin, whose team at UCL* has driven the technology behind the most advanced wafer substrates for RF applications,... Read more »
  • February 3, 2016 - Design & Reuse, in partnership with GlobalFoundries, ST, Soitec and Leti, is sponsoring a series of FD-SOI IP Workshops around the globe. (Click here for more information.) These working days aim at sharing information about IP that’s currently available or is being designed for FD-SOI technology. - The first conference will take place during DATE in Dresden on 14 March 2016.... Read more »
  • December 23, 2015 - Mentor Graphics is collaborating with GlobalFoundries on 22nm FD-SOI to qualify the Mentor® RTL to GDS platform for the current version of GlobalFoundries 22FDX™ platform reference flow. (Read the press release here.) This includes including Mentor's RealTime Designer™ physical RTL synthesis solution and Olympus-SoC™ place & route system. In addition, Mentor and GF are... Read more »
  • December 22, 2015 - Peregrine Semiconductor’s new UltraCMOS® PE44820 is an 8-bit digital phase shifter that delivers exceptional phase accuracy and high linearity for active antenna applications. - RF-SOI pioneer Peregrine Semiconductor has introduced the UltraCMOS® PE44820, an 8-bit digital phase shifter designed for active antenna apps, covering a 358.6-degree phase range. (Read the press release... Read more »
  • December 19, 2015 - Soitec CEO Paul Boudre - VLSI Research Chip Insider has named Soitec CEO Paul Boudre to its roster of 2015 All Stars of the Semiconductor Industry. (See the announcement here.) - Boudre was cited for “...successfully re-organizing Soitec back to its core business as a leading innovative engineered substrate supplier. His first year results are already astounding, with very high growth... Read more »

Latest posts
Why Dan Hutcheson/VLSIresearch, Inc. (finally!) Likes FD-SOI Thumbnail

Why Dan Hutcheson/VLSIresearch, Inc. (finally!) Likes FD-SOI

Posted by on May 27, 2016
In Design & Manufacturing, Editor's Blog
Tagged with , , , , , , ,

Dan Hutcheson, CEO of VLSIresearch, Inc. finally likes FD-SOI. That’s important, because he’s a really influential person in the chip world. Everybody who’s anybody in the chip biz pays attention to what VLSIresearch, Inc. has to say. Dan recently gave a talk entitled “FD-SOI: Disruptive or Just Another Process?” to a packed-to-the-brim room during the […]

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Impressive! Soitec FD-SOI Press Conference in China = >150 Articles Thumbnail

Impressive! Soitec FD-SOI Press Conference in China = >150 Articles

Posted by on May 11, 2016
In Editor's Blog
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FD-SOI makes sense for China. That was the key message SOI wafer leader Soitec made in a press conference on FD-SOI for a select group of journalists just before Semicon China this spring. News then quickly spread, and resulted in over 150 FD-SOI articles in the top China technology and business press. Soitec also put […]

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San Jose Symposium – Part 2 of 2 in an Epic Day for FD-SOI – the “Disruption Enabler” Right Through 7nm Thumbnail

San Jose Symposium – Part 2 of 2 in an Epic Day for FD-SOI – the “Disruption Enabler” Right Through 7nm

Posted by on April 29, 2016
In Conferences, Editor's Blog
Tagged with , , , , , , , , , , , , , , ,

This is part 2 (of 2) of ASN’s coverage of the epic FD-SOI Symposium in San Jose. In part 1 we looked at the exciting developments happening at 28nm (if you missed it, click here to read it now). Here in part 2, we’ll look at 22nm, covering the presentations by GlobalFoundries, ARM, VLSI Research […]

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San Jose Symposium: It Was an Epic Day for FD-SOI – Now Dubbed “The Smart Path to Success” [Part 1 of 2] Thumbnail

San Jose Symposium: It Was an Epic Day for FD-SOI – Now Dubbed “The Smart Path to Success” [Part 1 of 2]

Posted by on April 25, 2016
In Conferences, Editor's Blog
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The #1 take-away message from the recent FD-SOI Symposium in San Jose is that “FD-SOI is the smart path to success”. With presentations echoing that theme by virtually all the major players – including (finally!) ARM – to a packed house, it really was an epic day for the FD-SOI ecosystem. The presentations are now […]

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Why NXP’s i.MX 7 and 8 Applications Processors are Taking on IoT, Wearables, Automotive and Other Embedded Markets with 28nm FD-SOI [Part 2 of 2] Thumbnail

Why NXP’s i.MX 7 and 8 Applications Processors are Taking on IoT, Wearables, Automotive and Other Embedded Markets with 28nm FD-SOI [Part 2 of 2]

Posted by on April 7, 2016
In Design & Manufacturing, End-User Apps
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By Ronald M. Martino, Vice President, i.MX Applications Processor and Advanced Technology Adoption, NXP Semiconductors At NXP, we’re very excited about the prospects for our new i.MX 7 and 8 series of applications processors, which we’re manufacturing on 28nm FD-SOI. As noted in part 1 of this article series, the new i.MX 7 series, which […]

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