#14 | WINTER 2009
posted December 04, 2009
Home
SOI in Action
The Cell Regza 55X1 consists of an HD LCD 55” TV and a tuner housing the Cell chip and hard drive.
(Courtesy: Toshiba)
-
The ARM test chip, in 45nm high-performance SOI technology, was based on an ARM 1176™ processor. It provided up to 40% power savings and a 7% circuit area reduction compared to bulk CMOS low-power (LP) technology, operating at the same speed. This same implementation also demonstrated 20% higher operating frequency capability over bulk while saving 30% in total power in specific test applications. (Courtesy: ARM)
FEATURE:
the SOI design experience
Roma Rudra, the ARM engineer responsible for shifting the ARM11 design from bulk to SOI, describes the process. The mobile apps chip posted a 40% power saving with the move to SOI – without any major rework in design methodology.
ESD expert Steve Voldman explains why SOI is a great tool for handling electrostatic discharge.
Nghia Phan of IBM explains how to handle SRAM sense amps in SOI design.
In & Around Our Industry
EuroAsia Semiconductor magazine awards Tronics “Foundry of the Year” for growth in the downturn.
Advanced Substrate Corners
Special Supplement: SOI Industry Consortium
The SOI Consortium-sponsored FinFET study made the cover of the November 2009 issue of SST magazine.
Reports & Papers
• “De-myth-tifying” the SOI Floating Body Effect by Bob Ulicki and Herb Reiter
• SOI Implementation from Infotech Enterprises
• SOI vs. Bulk FinFETs at 22nm – on the cover of SST
• SOI Implementation Guide - a new chapter covering VCO, CCO, PLL and DLL devices
Events
• News Flash: FD-SOI Readiness Workshop
Thank you !
A special thanks goes to Toshiba, Cadence, ARM, Freescale, IBM, UCL, KT, UC Berkeley, NXP, IMEC, Dr. Steve Voldman, Cissoid, the SOI Industry Consortium and Soitec for their help with this issue.