#10 | SUMMER 2008

posted July 16, 2008

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LEAD STORY

GSA/SOI Industry Consortium Survey: the results, and why they should change the way the industry thinks about SOI.

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DESIGN FEATURE

SOI Design for the MainstreamHome_DesignFeature

• Remy Pottier looks behind the SOI doors ARM is opening.

• Kevin Kranen of Synopsys describes how designers can “have it all” with SOI.

• Mentor’s tools keep SOI transparent and robust, explains Michael White.

• IBM’s Tony Bonaccio shows how analog designers reap the same SOI benefits as their confreres in the digital world.

In & Around Our IndustryHome_People_285

PEOPLE

• Soitec’s Paul Boudre named COO.
• Cissoid names Tony Denayer as CEO.
• ISi’s Victor Koldyaev is first Fellow.

ANALYST’S PERSPECTIVE

Yole’s Eric Mounier predicts hot growth for 3D ICs.

R&D OUTLOOK

Carlos Mazuré of Soitec considers enabling technologies for 3D integration.

SHOPTALK

Mattson’s Andreas Toennis explains the role of RTP innovations in advanced SOI wafers.

Advanced Substrate Corners

III-V CORNER

Thomas Kazior talks about important breakthroughs by a Raytheon-led team integrating III-V and silicon on a single chip for RF.

IMAGING

Francois Roy of STMicroelectronics describes work on SOI-based back-illuminated image sensors for digital cameras.

logo_SOIconsortium_195Special Supplement:
SOI Industry Consortium

• The success of the GSA/SOI consortium survey and lots of activity is getting the word out, says Executive Director Horacio Mendez.

• What’s new: guides, members, website updates.

• Good buzz from events at TSMC and DAC.

 

Thank You!

A special thanks goes to the GSA, Synopsys, Mentor, ARM, IBM, Cissoid, ISi, Mattson, Yole, Raytheon, ST, Debiotech, Toshiba, AMD, DAC, the SOI Consortium and Soitec for their help with this issue.